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2025-05-15
Automatic WDS 850 BGA Rework Station 80*80mm Chips
The Automatic WDS 850 BGA Rework Station is a state-of-the-art equipment. It is designed for handling 80*80mm chips.
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2025-05-13
Enhancing Precision in BGA Chip Rework: The Automatic WDS 850 Station
The Automatic WDS 850 BGA Rework Station is designed to address the growing needs of electronic manufacturers who work with Ball Grid Array (BGA) chips. With the increasing complexity of modern electronic devices, the demand for reliable and efficient rework stations has surged. The WDS 850 is specifically tailored for handling 80*80mm chips, making it a versatile addition to any production line o
2025-05-09
Transform Your Production Line with the WDS 620 BGA Reballing Solution
Transform Your Production Line with the WDS 620 BGA Reballing Solution Table of Contents 1. Introduction to BGA Reballing 2. What is BGA Reballing? 3. Importance of BGA Reballing in Electronics Manufacturing 4. Introduction to the WDS 620 BGA Reballing Solution 5. Key Features of the WDS 620 BGA Reballing Solution 6. Benefits of Using the WDS 620 BGA Reballing Solution
2025-05-05
Understanding BGA Desoldering Machines: Essential Tools for Electronic Manufacturing
In the realm of electronic manufacturing, precision and efficiency are paramount, especially when it comes to assembling and repairing complex circuit boards. One crucial tool that plays a significant role in this process is the BGA (Ball Grid Array) desoldering machine. These machines are designed to remove BGA components from printed circuit boards (PCBs) without causing damage to the board or o
2025-05-01
Top Features of the Manual WDS 580 BGA Station with IR Preheater You Should Know
Top Features of the Manual WDS 580 BGA Station with IR Preheater You Should Know Introduction to the WDS 580 BGA Station The Manual WDS 580 BGA Station with IR Preheater is a cutting-edge piece of equipment designed for professionals in the electronics manufacturing industry. This station offers a combination of advanced features that streamline the process of soldering BGA (Ball Grid Array) compo
2025-04-27
Enhancing BGA Rework Efficiency with WDS 850 Touch Screen and Vacuum Adsorption Technology
The WDS 850 Touch Screen BGA Rework Station with Vacuum Adsorp technology is a cutting-edge solution designed for the robust demands of electronic manufacturing and repair. As the industry progresses towards more intricate and compact circuit designs, efficient rework tools have become essential. This equipment is particularly suited for Ball Grid Array (BGA) components, which are known for their