- Product Detail
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Highlight: 6800W Laptop BGA Machine, Infrared Laptop BGA Machine, 220V Reballing Station BGA
Rated Capacity:
6800W
Use:
Repair BGA Chip
Dimensions:
L830*W670*H850mm
Weight:
75KG
PCB Size:
Max 570*480mm Min 10*10 Mm
BGA Chip:
Max 80*80mm,Min 1*1mm
Heating Power:
Upper Hot Air:1200W,Lower Hot Air:1200W,IR Zone:4200W
After-sales Service Provided:
Free Spare Parts
Certification:
CE ISO
Warranty:
1 Year
Voltage:
220V/110V
6800W Laptop BGA Machine WDS-750 220V Infrared For Chips Repairing
WDS-750 Optical Alignment BGA Rework Station High temperature control system
Features:
1.Touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use;
2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield;
3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling;
4.Auto feed chip,auto pick up chip,auto blowing chip,can identify the central position automatically when optical alignment;
5.Multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users;
6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within ±1 ℃；
7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm;
8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users;
9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts;
10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional).
WDS-750 parameter:
Total power 6800W Upper heating power 1200W Bottom heating power 1200W Bottom IR heating power 4200W(2400W is controlled) Power supply (Single Phase) AC 220V±10 50Hz Location way Optical camera+ V-shape card slot + laser position for fast location Temperature control High precision K sensor closed loop control,independent temperature control with ±1 ℃ precision Appliance selection High sensitive touch screen + temperature control mode +Panasonic PLC +step driver Max. PCB size 550×480mm Min. PCB size 10×10mm Sensor 4units Chip amplification multiple 1-200X PCB thickness 0.5-8mm Chip size 0.2*0.4mm-9cm Min. chip space 0.15mm Max. mount loading 100G Mount precision ±0.01mm Overall size L670×W770×H900mm Optical camera Can be removed front and back,left and right,prevent the dead angle Machine weight 90kg
6800W Laptop BGA Machine WDS-750 220V Infrared For Chips Repairing
Product Details Place of Origin: China Brand Name: WDS Certification: CE Model Number: WDS-750 Document: Product Brochure PDF Payment & Shipping Terms Minimum Order Quantity: 1 UNIT Packaging Details: Wooden case Delivery Time: 8-15 working days Payment Terms: T/T, Western Union, MoneyGram Supply Ability: 150 UNITS PER MONTH
Document: Product Brochure PDFCategories:
keyword:
Semi Automatic BGA Rework Station
Factory Tour
More than 10 years of experience in BGA rework station and X-ray industrial machinery production.
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+8618926538696(Work Time)
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> Fax : 86-0755-2733-6216
> Email : service@wdsbga.cn
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