- Product Detail
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The heating head X/Y axis on this equipment can move left and right, front and back. According to the different BGA positions of the PCB motherboard, theheating head is moved to the designated rework chip position. The upper heating head moves at the same time, and the lower heating headfollows the position of the upper heating head to reach the correspondingposition. The upper heating head X/Y axis is servo-controlled, and the movingspeed is adjustable. The third preheating temperature zone of the rework station can be electrically moved left and right, front and back, and up and down. Advantages: Mainly for large server motherboards or large PCB motherboards,the chip at the edge of the PCB motherboard can be moved to any edge position of the PCB by moving the heating head, ensuring the preheating of the entire PCB motherboard, thereby controlling the PCB motherboard from deformation and improving the soldering yield.。 Independent three-zone air pressure temperature control system Upper heating system: 3200W, lower heating system: 2000W, infrared preheating system: 38400W, other power: 2400W and above. Power levels above this level meet the temperature compensation requirements of various reworked components. An industrial computer controls the operating system, displaying real-time temperature curves, including set and actual curves, and allowing for analysis. Three independent heating zones, each with programmable heating temperature, heating time, and ramp rate. 12 heating cycles simulate reflow soldering for truly non-destructive rework. Utilizing high-precision K-type thermocouples imported from the United States, closed-loop control and a unique heating method ensure soldering temperature accuracy within ±1°C. 14 independent temperature measurement ports accurately monitor chip solder point temperatures, ensuring soldering success rates
Factory Tour
More than 10 years of experience in BGA rework station and X-ray industrial machinery production.
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