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WDS-2000 Rework Station Main Features：✅ Fully Automatic with Mark Point Recognition Equipped with a 1200W pixel high-resolution industrial camera that automatically identifies Mark points for ultra-precise, sub-micron level positioning (accuracy up to ±10µm). Eliminates manual alignment, ensuring consistent, error-free results for batch production.✅ Advanced Hybrid Heating System Upper Zone: High-power hot air heating (max 2000W) for rapid, uniform top-side reflow. Lower Zone: High-power hot air heating (max 2000W) for balanced bottom heating. Infrared Preheater: German-imported Elstein dark infrared heating plate with a massive 720×580 mm preheat area (max 12000W, zone-controlled). Preheat Logic: IR preheater starts first; main heating begins only when the PCB reaches a set trigger temperature — reduces thermal stress, prevents warping, and increases yield.Eight-Axis Synchronized Motion Control 8 servo motors control:o Upper/lower heating heads (X/Y)o Vision alignment system (X/Y)o Z-axis lift for upper heater and lower zone All movements are software-controlled for maximum precision and automation.✅ Independent Three-Zone Design I. Upper Heating Zone II. Lower Heating Zone III. Infrared Preheating Zone Upper and lower heating heads can move automatically to any position on the PCB, ensuring the target chip is perfectly aligned without moving the board.✅ Precision Placement & Vacuum Control Built-in vacuum pump with Φ-axis rotatable nozzles High-precision stepper motor control with auto-memory function Micro-adjustable suction nozzles Automatic height & pressure sensing (down to 10g) Zero-pressure pickup and placement for delicate microchips✅ Intelligent Temperature Management Closed-Loop Control: High-precision K-type thermocouples ensure temperature accuracy of ±1°C. 5 built-in thermocouple ports for real-time multi-point monitoring. Real-time curve display: Compare set curve vs. actual measured curve. 10-stage ramp-up, 10-stage ramp-down control. Massive curve storage (10,000+ profiles) with on-screen analysis.Large Working Area & Flexibility Max PCB size: 1030×700 mm (customizable) Min PCB size: 10×10 mm PCB thickness: 0.3–8 mm Component size range: 0.6×0.6 mm to 120×120 mm Suitable for high-density, fine-pitch components✅ Enhanced Safety & Connectivity Nitrogen Inlet: Supports inert atmosphere welding for oxidation-free joints. Dual Safety Light Curtains: Automatically stops all motion if a foreign object or person crosses the safety zone — double protection for operators. Manual Blow-off Cooling: Suction nozzle has a manual blow function to cool the chip surface instantly, protecting sensitive components from overheating. High-Speed Cooling Fan: Rapidly cools the PCB after rework. MES Port: Ready for integration into factory automation systems. Remote Control: Internet-enabled for remote monitoring and operation. Optional Side Camera: Monitor solder ball melting in real time (optional).✅ Standard Automatic De-Soldering Integrated automatic de-soldering function removes solder residue without manual scraping, reducing PCB damage and improving efficiency.
New arrivel WDS-2000 BGA rework station fully automatic computer contral
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