Advanced Bga Rework Station
Release date: 2025-07-24
A BGA Rework Station is an essential tool in electronics repair and manufacturing. It is designed for Ball Grid Array (BGA) component rework. It can precisely control temperature for soldering and desoldering BGA parts, ensuring reliable connections. It helps in replacing faulty BGAs on printed circuit boards efficiently.
The WDS-700 BGA Rework Station is a high-performance, fully automated system designed for precision SMT rework, including BGA, CSP, and QFN components. Ideal for mobile phone repairs and PCB rework, it combines advanced temperature control, optical alignment, and user-friendly operation for flawless results.
Key Features:
✔ 5-in-1 Smart Modes – Choose from Remove, Mount, Weld, Manual, or Semi-Auto modes for flexible operation.
✔ Dual Heating Zones – Independent upper & lower IR heating with ±1℃ accuracy, 8-segment PID control, and real-time curve analysis.
✔ High-Def CCD Alignment – Adjustable 15" LCD monitor with auto-focus, split-screen, and brightness/contrast control for perfect component placement.
✔ Ultra-Precise Positioning – Micrometer X/Y/R-axis fine-tuning (±0.01mm) and 360° rotatable titanium nozzles ensure accuracy.
✔ Safety Protections – Auto power-off, overheat alarms, and password-locked settings for secure operation.
Technical Specs:
- Power: 220V/110V, 2600W
- PCB Size: Max 140x160mm, Min 5x5mm
- Chip Size: Max 50x50mm, Min 1x1mm
- Touchscreen: HD interface with data storage
Why Choose WDS-700?
With closed-loop K-type thermocouples, PLC smart control, and instant temperature feedback, this station delivers professional-grade rework with industrial reliability. Perfect for workshops needing speed, precision, and repeatability.
Contact Us
> Work Time: 0:00-23:59
> Whatsapp:
+8618926538696(Work Time)
+8618926538696(Wechat)
> Fax : 86-0755-2733-6216
> Email : service@wdsbga.cn
Powered by www.300.cn