BGA desoldering station
Release date: 2025-04-17
A BGA desoldering station is a crucial device in electronics repair. It is specifically designed for desoldering Ball Grid Array (BGA) components. It typically features precise temperature control to ensure safe and effective removal of soldered parts. With adjustable settings, it can handle different types of BGAs, facilitating component replacement and board repair.
The BGA desoldering station is a vital piece of equipment in the electronics repair and rework field.
It is specifically engineered for desoldering Ball Grid Array (BGA) components. This station provides highly efficient and controlled desoldering. It uses advanced heating technology to quickly melt the solder joints around the BGA, allowing for the clean removal of the component from the printed circuit board (PCB).
The key feature of the BGA desoldering station is its precise temperature regulation. It can be adjusted to the exact temperature required for different types of solder alloys, ensuring that the desoldering process is carried out without causing damage to the PCB or surrounding components.
In addition, it has a well - designed nozzle system. The nozzles are available in various sizes and shapes, enabling them to fit snugly around different BGA components. This ensures that the heat is focused precisely on the solder joints, enhancing the effectiveness of the desoldering operation.
Contact Us
> Work Time: 0:00-23:59
> Whatsapp:
+8618926538696(Work Time)
+8618926538696(Wechat)
> Fax : 86-0755-2733-6216
> Email : service@wdsbga.cn
Powered by www.300.cn