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China Fully Automatic Bga Rework Station

Release date: 2025-11-11

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The Fully Automatic BGA Rework Station is an advanced piece of equipment in electronics repair. It can precisely handle the rework of Ball Grid Array (BGA) components. With automated functions, it ensures high - precision heating, soldering, and desoldering processes. Its user - friendly interface allows operators to set parameters easily, guaranteeing efficient and reliable BGA rework results. 

The Fully Automatic BGA Rework Station represents the pinnacle of precision and efficiency in electronics repair and rework technology. This industrial-grade system is engineered to automate the complex process of removing and replacing Ball Grid Array (BGA) components on printed circuit boards (PCBs) with unparalleled accuracy and repeatability. Its core performance lies in handling a vast range of PCB sizes, from miniature 10x10mm boards found in smartphones to large-format 640x490mm industrial motherboards, with a compatible thickness of 0.8mm to 8mm. The integration of a powerful 12,000W heating system, comprising an 8,000W bottom heater and a 1,200W upper heater, ensures rapid, uniform, and controlled thermal profiling for perfect reflow soldering without thermal damage to sensitive components.

Fully Automatic BGA Rework Station

A defining feature of this Fully Automatic BGA Rework Station is its complete automation, encompassing an automatic feeding device, precise X/Y/Z movable positioning, and automatic vision alignment for flawless BGA placement. Operated via an intuitive Windows-based software control system and monitored on a high-definition screen, the station provides millisecond-level process control, real-time temperature curve tracking, and data logging for guaranteed consistency. Key highlights include its robust 580kg construction for stability, support for both 220V/110V operation, and a foot pedal for hands-free control. This Fully Automatic BGA Rework Station is an indispensable tool for high-volume manufacturing repair lines, R&D departments, and professional repair services, drastically reducing human error and elevating throughput and first-pass yield in critical BGA rework applications.

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