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WDS1800 Fully Automatic BGA Rework Station with Auto Feeding System and air

WDS1800 Fully Automatic BGA Rework Station with Auto Feeding System and air

Product Details Place of Origin: CHINA Brand Name: WDS Certification: CE Model Number: WDS1800 Document: Product Brochure PDF Payment & Shipping Terms

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Fully computer controlled WDS-880E BGA rework station Can be connected MES system

Fully computer controlled WDS-880E BGA rework station Can be connected MES system

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WDS580 hot air Soldering Rework Station with PLC Temperature Control and IR heater

WDS580 hot air Soldering Rework Station with PLC Temperature Control and IR heater

Product Details Place of Origin: China Brand Name: WDS Certification: CE Model Number: WDS580 Document: Product Brochure PDF Payment & Shipping Terms Minimum Order Quantity: 1 UNIT Packaging Details: Wooden case Delivery Time: 3-5 working days Payment Terms: T/T, Western Union, MoneyGram Supply Ability: 150 UNITS PER MONTH

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High Precision BGA Reballing Machine WDS 620 AC 220V with 5200W Power

High Precision BGA Reballing Machine WDS 620 AC 220V with 5200W Power

Product Details Place of Origin: China Brand Name: WDS Certification: CE Model Number: WDS-620 Document: Product Brochure PDF Payment & Shipping Terms Minimum Order Quantity: 1 UNIT Packaging Details: Wooden case Delivery Time: 8-15 working days Payment Terms: T/T, Western Union, MoneyGram Supply Ability: 150 UNITS PER MONTH

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Hot air heater repair PCB Semi Automatic BGA chip rework station WDS-650

Hot air heater repair PCB Semi Automatic BGA chip rework station WDS-650

Product Details Place of Origin: China Brand Name: WDS Certification: CE Model Number:WDS-650 Document: Product Brochure PDF Payment & Shipping Terms Minimum Order Quantity: 1 Packaging Details: wooden case Delivery Time: 8-15 working days Payment Terms: T/T, Western Union, MoneyGram Supply Ability: 150 UNITS PER MONTH

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WDS-880D Equipment Appearance

WDS-880D Equipment Appearance

WDS-880D Main Features:Hot air head and mounting head integrated design, with automatic mounting automatic welding and automatic dismantling function;The upper air head adopts the hot air system, quick heating, uniform temperature, fast cooling (cooling can drop 50-80 degrees), to better meet the requirements of lead-free soldering process.Lead-free soldering process requirements. Lower hot temperature area are used infrared + hot air hybrid heating, infrared directly on the heating area, and hot air conduction at the same time, which can make up for each other's shortcomings, so that the PCB warming up fast (warming rate of 10 ℃ / S), while the temperature is still maintained at an even temperature; Independent three temperature zones (upper temperature zone, lower temperature zone, infrared preheating zone), the upper temperature zone and the lower temperature zone to achieve synchronized automatic movement, can automatically reach the bottom of the infrared preheating zone in any position. The lower temperature zone can move up and down to support the PCB, which is automatically controlled by motor. Realize the PCB in the fixture does not move, the upper and lower heating head can move to the PCB target chip;PCB board adopts high-precision slider to ensure the placement accuracy of BGA and PCB board.Original bottom preheating platform, using excellent heating materials imported from Germany (infrared gold-plated light tube) + anti-glare thermostatic glass (temperature resistance up to 1800 ℃) preheating area of 500 * 420mm; the preheating area of 500 * 420mm. 1800℃) preheating area of 500*420mm.The preheating platform, clamping device and cooling system can be moved in X direction. It makes PCB positioning and soldering safer and more convenient.X,Y adopts motor automatic control of the movement mode, so that the alignment is fast and convenient, the equipment space is fully utilized to achieve a relatively small equipment volume of ultra-large area PCB rework, the maximum size of the clamping plate can be up to 590 * 400mm, no rework dead ends;Dual joystick control, alignment lens and upper and lower heating platform to ensure alignment accuracy;Built-in vacuum pump, φ angle rotation, precision fine-tuning mounting nozzle;The suction nozzle automatically recognizes the suction and mounting height, and the pressure can be controlled within a tiny range of 10 grams, with 0 pressure suction and mounting functions for smaller chips;Color optical vision system with manual X, Y direction movement, with spectral dual-color, magnification and fine-tuning functions, including chromatic aberration resolution device, auto-focus, software operation, can be returned to repair the largest BGA size 80 * 80 mm;Various sizes of alloy hot air nozzles, easy to replace, can be rotated 360 ° positioning;Configuration of 4 temperature measurement ports, with multi-point real-time temperature monitoring and analysis;With solid-state operation display function, so that the temperature control is more safe and reliable;The machine can automatically generate SMT standard temperature disassembly curve under the temperature of different environments in different regions, without the need to manually set the curve of the machine, with or without the experience of the operator can be used to realize the intelligence of the machine;With a camera to observe the melting point of the side of the tin ball, easy to determine the curve (this function is optional). 三．WDS-680D parameters： total power6000WUpper heating power1600WLower heating power1600WInfrared heating powerTotal IR power is 4000Wpower supplytwo-phase 220V、50/60HzPositioning methodV-slot for PCB fixing, laser positioning light for quick positioning, motor can be moved freely by rocker control X, Y axistemperature controlHigh-precision K-type thermocouple (Ksensor) closed loop control (Closed Loop), the upper and lower independent temperature measurement temperature control accuracy of up to ± 1 degree;Electrical SelectionPC control system + high-precision temperature control module + motion control board card+ Panasonic servo + stepper driveTin spot monitoringexternal camera to monitor the melting process of tin balls during the soldering process (optional)MES systemReserve MES portFeeding deviceFeeding device Automatic feeding deviceMaximum PCB Size590*400mmMinimum PCB Size10*10mmTemperature measurementinterface4 piecesChip zoom in and out2 to 80 timesPCB Thickness0.5~10mmApplicable Chip Size0.8*0.8~90*90mmApplicable Minimum chip pitch0.15mmMaximum load for mounting500gMounting accuracy±0.01mmOverall dimensionsL820*W706*H1400mmMachine WeightAbout 200KGOther featuresDual joystick operation, automatic & manual mode free switching, 7-axis motorized motion control, unique dual-channel heating technology PCB preheating, MES port; smoke purification system

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