Quality Bga Rework Station
Release date: 2025-07-24
A BGA rework station is an essential device in electronics manufacturing and repair. It enables precise soldering and desoldering of BGA components. With features like accurate temperature control, adjustable air - flow, and a variety of nozzles, it can handle different BGA sizes, ensuring high - quality rework on printed circuit boards.
The WDS-900 BGA Rework Station is a high-performance, compact system designed for precise, professional chip rework on large-scale PCBs up to 760×630mm. It integrates infrared and hot air heating with optional nitrogen/air, offering a 3-in-1 heating method ideal for advanced chip repair including BGA, QFN, CSP, LGA, and POP.
With a chip size range of 0.8×0.8mm to 120×120mm, minimum spacing of 0.15mm, and mounting accuracy of ±0.01mm, the WDS-900 ensures ultra-precise placement. The system features independent triple temperature zones (upper, lower, and IR preheating) with closed-loop control via K-type thermocouples, ensuring fast, uniform heating and controlled cooling.
This software-controlled rework station uses seven motor-driven axes with joystick operation for full control over alignment and head movement. It includes a 2-in-1 mounting and heating head with auto-rotate, place, solder, and remove functions, plus a built-in vacuum pump, automatic suction height detection, and high-definition optical system with 22x zoom and autofocus.
WDS-900 stores over 100 programmable temperature curves and can auto-generate optimal profiles for lead-free processes, making it ideal for both manual and mass production environments. Optional side-view camera and multi-point temperature sensors add further precision.
Compact yet powerful, the WDS-900 BGA Rework Station is the intelligent solution for complex chip rework with speed, accuracy, and reliability.
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