The WDS 620 Laser Reballing Station with 3 Zones is a sophisticated piece of equipment. It is mainly used for reballing operations in electronics. With three zones, it offers enhanced precision and control. The laser technology enables accurate ball placement on components, ensuring reliable and high - quality reballing processes.
The WDS 620 Laser Reballing Station with 3 Zones is a fully automatic, infrared-assisted solution designed for precise reballing of complex SMD and BGA components. Supporting PCBs from 10×10mm to 750×620mm and up to 8mm thickness, this advanced station is ideal for large board repair and mass production environments.

Equipped with independent three-zone temperature control (upper, lower, and laser-assisted infrared), the WDS-620 ensures rapid, uniform heating and cooling. The built-in temperature monitoring system with 5 sensors provides real-time data and thermal accuracy for lead-free and delicate chip reballing processes.
The WDS-620 integrates an auto-zoom optical system (2x–50x) for chip inspection, placement, and alignment. Its high-precision ±0.01mm mounting, supported by motor-driven axis control and automatic chip handling, guarantees perfect solder ball alignment and chip integrity.
Featuring software-controlled operation, a laser-enhanced reflow system, and real-time temperature curve analysis, this station combines cutting-edge infrared and laser technology to achieve fast, efficient, and safe reballing. The unit also supports nitrogen protection for oxidation-free soldering.
Compact, intelligent, and highly automated, the WDS-620 Laser Reballing Station is the ideal choice for repair centers, manufacturing lines, and high-end electronics requiring reliable, high-precision chip rework.